1 / 4 www.asb.co.kr september 201 2 p lerow tm aln110 3 r2 internall y matched lna module the plerow tm aln - series is the compa ctly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv a nd so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the a pplication system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 950 1250 gain db 3 1 .5 3 2 .5 gain flatness db ? 1. 4 ? 1. 5 noise figure db 0. 65 0. 7 output ip3 (1) dbm 34 35 s11/s22 (2) db - 1 4 / - 1 4 output p1db dbm 20 21 switching time (3) ? sec - supply current ma 1 0 5 1 2 5 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 2 9 ~ 31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is C 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 4 dbm/tone separated by 1 mhz. 2) s11, s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage f rom 0 v to v s . pin number function 2 rf in 4 v s 6 rf out other s ground ou t line drawing (unit: mm) note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. (recommended footprint) aln110 3 r2 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area c o u pl er c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type s 21 = 33.9 db@950 mhz = 31.1 db@1250 mhz nf of 0. 65 db over freque n cy unconditionally stable single 5 v supply high oip3@low current feature s descripti on specifications (in pr o duction) typ.@t = 25 ? c, v s = 5 v, freq. = 1100 mhz, z o.sys = 50 ohms
2 / 4 www.asb.co.kr september 201 2 p lerow tm aln110 3 r2 internall y matched lna module s - param e te rs noise figure oip3 p1db 950~ 125 0 +5 v stability fa c tor (k) typical performance (measured)
3 / 4 www.asb.co.kr september 201 2 p lerow tm aln110 3 r2 internall y matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 950 mhz 1100 mhz 1250 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s2 1 (db) s11 (db) s22 (db) 4.50 v 33. 1 3 - 16. 5 5 - 1 5 .85 32. 1 1 2.48 - 18.8 8 - 19 .95 30.6 5 - 1 8 .57 - 16.90 4.75 v 33. 3 6 - 16. 3 8 - 1 6 . 0 4 32. 4 6 2.42 - 19.2 0 - 19 . 6 4 30. 94 - 1 9 .02 - 17.20 5.00 v 33.50 - 16.23 - 16.27 32.65 2.35 - 19.64 - 19.47 31.15 - 19.81 - 17.40 5.25 v 33.6 4 - 15.99 - 16.45 32.83 2.31 - 20.36 - 19.15 31.33 - 20.21 - 17.85 5.50 v 33.70 - 15.90 - 16.71 32.88 2.31 - 20.73 - 18.85 31.39 - 20.45 - 18.05 950 mhz 1100 mhz 1250 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (d b) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 3 4 .70 20.32 0.6 2 3 3 4 .38 20.57 0.6 4 6 3 3 .05 19.43 0.6 2 2 4.75 v 3 5 .34 21.00 0. 63 2 3 5 .45 21.17 0.6 4 0 3 4 .15 20.39 0.6 2 4 5.00 v 3 6 .61 21.55 0. 645 3 6. 23 21.76 0.6 4 2 3 5 .02 21.08 0.6 2 4 5.25 v 3 6 .62 21.97 0. 64 7 3 6 .18 22.18 0.6 5 3 3 5 .05 21.52 0.6 2 7 5.50 v 3 6 .68 22.43 0. 660 3 6 .15 22.54 0.6 6 2 35.12 21.87 0.6 3 6 950 mhz 1100 mhz 1250 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 ? c 3 3.8 0 - 18.77 - 15.20 3 2.9 7 2.34 - 19.53 - 19.55 3 1.4 6 - 17.40 - 19.22 - 10 ? c 3 3.6 0 - 1 7.10 - 1 5.89 3 2.7 3 2.37 - 19.58 - 19.50 3 1.2 3 - 18. 5 1 - 18.11 25 ? c 3 3.4 8 - 16.23 - 16.27 3 2.6 0 2. 38 - 19.64 - 19.47 31. 1 0 - 19.81 - 17.40 60 ? c 3 2.7 5 - 18. 65 - 17 .54 3 1.87 2. 36 - 19.45 - 1 9.98 3 0 . 3 9 - 18. 75 - 17 .90 85 ? c 32. 1 3 - 20.21 - 17.85 31. 1 6 2. 39 - 19.08 - 21.73 29.7 4 - 17.36 - 18.99 950 mhz 1100 mhz 1250 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 ? c 37. 6 3 22. 30 0.4 30 37.50 22. 30 0. 390 37.45 22. 10 0. 350 - 10 ? c 37. 50 22. 10 0.5 45 37.10 22. 60 0. 485 37.05 21. 75 0. 485 25 ? c 36. 70 21. 60 0.645 36.20 22.00 0.638 36.12 21. 20 0.625 60 ? c 35. 80 21. 20 0.8 5 0 35.12 2 1 . 30 0.789 35.20 20. 90 0.779 85 ? c 35.40 20. 70 0.9 10 34.82 20 . 80 0. 865 34.65 20.15 0.843 rf performance with operating temperature rf performance with voltage change
4 / 4 www.asb.co.kr september 201 2 p lerow tm aln110 3 r2 internall y matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. t he value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor size 25x25 mm (for aln - r series C 10x10 mm) evaluation board layout in out vs
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